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Polycarbonate Resin CH8225 BK product packaging

PC material

Grade CH8225 BK

A black low-viscosity high-flow grade for thin-wall and geometrically complex molded parts.

Category
PC
Packaging
25 kg bag
Discuss this grade

Overview

A black low-viscosity high-flow grade for thin-wall and geometrically complex molded parts.

Key properties

  • MFR approx. 22
  • High flow
  • Easy release

Applications

  • Thin-wall components
  • Electrical housings

Processing guidance

  • Confirm the resin preparation and drying profile against the current technical data and your equipment conditions.
  • Set the molding window around part geometry, wall distribution, tooling, gate design and required surface appearance.
  • Review filling, venting, cooling and release behavior during trials before approving the production setup.

Customization

Color matching and application-oriented modification can be reviewed against the target appearance, flow, impact, weathering and other required properties. Feasibility is confirmed for the selected grade.

Packaging

25 kg bag

Technical documents

Request the currently available material data and supporting documents for this grade and intended use.

Request technical documents

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